CryoTEM Krios G4 is the latest and most advanced CryoTEM commissioned and opened in 2025. It’s equipped with cold-FEG, Panther STEM detector, EMPAD, CetaD camera and Selectris Energy filter with Falcon4i electron direct detector….
Materials
Ultrawide FoV Atom Probe Tomography
The APT device enables near-atomic level resolution (~0.2 nm depth & ~0.4 nm lateral) and 3D compositional mapping with high chemical sensitivity (<5 appm) by field evaporation and time-of-flight mass spectrometry. ...
X-ray Reflectometry and Diffractometry (XDD) Beamline
XDD beam line and its experimental station are designed for a general purpose of diffractometry, fluorescence detection and absorption spectroscopy, which will serve the research and development with structural determination, characterization and process monitoring in universities, institutes and industry in Singapore and the region….
Ga+ Large Chamber FIB
The Versa 3D DualBeam FEG FIB-SEM combines a focused Ga ion beam with a high-resolution field-emission electron gun. Owing to a large chamber allowing up to 6″ industry wafers with full rotation, the Versa 3D provides enhanced 2D and 3D materials characterization and analysis for a wide range of material science and industry-related samples….
X-ray Photoelectron Spectroscopy
Our most advanced XPS AXIS Supra+ provides a range of applications for surface science analysis. It comes with a heat and cool accessories that allow samples mounted on the sample holder to be heated up to +800°C or cooled to <100°C within the Flexi-lock and/or Sample Analysis Chamber....
Inline Multi-Chamber Magnetron Sputter Deposition
This multichamber physical vapour deposition (PVD) sputtering platform is designed to handle silicon wafers and glass panes. The SV-540 is a state-of-the-art machine having dedicated chambers for the sputtering of metallic, dielectric and TCO/TMO layers. The processing chambers are equipped with planar magnetron sources for DC sputtering of metals, oxides and oxynitrides in the reactive mode, and with a cylindrical dual-magnetron source and planar sources for pulsed DC sputtering of dielectrics and TCOs/TMOs, with substrate heating up to 500 degree Celsius….
Atomic Force Microscope (In Glovebox)
A versatile AFM that can capture images of air-sensitive materials that are inherently distortion-free and reproducible. Equipped with easy tip exchange combined with SmartScan software’s one-click imaging and pre-programmed advanced modes. …
Wire Bonder
Benchtop semi-auto wire bonder …
Photo and Electroluminescence Imaging System
This photoluminescence imaging tool can perform luminescence study of silicon solar cells and wafers. It gives visual information about the defects on the sample….
High Precision Large Area Solar Cell I-V Tester
LED I-V tester performs I-V measurement to determine the power conversion efficinecy of solar cell. It uses LED light enigne as light source, with illumination area of 16 cm x 16 cm. It is ideal for performing measurement of 5 busbar M2 sized solar cell….
General Purpose Solar Cell I-V Tester
Xenon-lamp based I-V tester performs I-V measurement to determine the power conversion efficiency of solar cell. We provide solar cell measurement services in accordance to ISO 17025, accredited by SAC….
Inline Magnetron Sputter Deposition System
This inline sputtering tool from FHR Anlagenbau, Germany has three planar magnetron sources, whereby two sources are connected to a DC power supply for DC sputtering of metal layers, while the third source is connected to an RF power supply for the deposition of dielectric films….
TT1800 Stringer For 6-BB Cell Technology
Used for the automatic soldering of metal ribbons onto solar cells and interconnecting solar cells into strings. SERIS’ customised TT1800 stringer is capable of interconnecting standard silicon solar cells with up to 6 busbars as well as interdigitated-back-contact solar cells. Both full-size cells and half-cut cells can be processed….
Long Pulse I-V Tester for PV Modules
Xenon-lamp based flash I-V tester performs I-V measurement to determine the power conversion efficiency of photovoltaic module. We provide solar cell measurement services in accordance to ISO 17025, accredited by SAC….
Outdoor PID Testing System
Custom setup to perform outdoor Potential Induced Degradation stress on PV module. System will apply up to +1500 or -1500 V to the PV modules for a specified duration….
SINS Extra Ultraviolet (EUV) Branch Beamline
Extra Ultraviolet (EUV) Branch Beamline is a second branch of the main SINS beamline. Its primary purpose is to measure the reflectivity of EUV optical components…
Soft X-ray-Ultraviolet (SUV) Beamline
The soft X-ray-ultraviolet (SUV) beamline is a state-of-the-art beamline producing photons with selective polarizations. It covers the photon energy range from soft X-ray to ultraviolet, which can be used for various advanced optical, spectroscopy and scattering measurements. This integrated characterization-and-growth facility aims to study and distinguish the interplay between spin, charge, orbital and lattice degrees of freedom of advanced materials from solid state physics to biological systems, with various forms, e.g. nanoparticle, ultrathin film to bulk….
Thermal Evaporator
The SCT Thermal Evaporator is a lab-scale tool for depositing metal and other functional thin films (Al, Ag, etc) onto various substrates (silicon wafers, glass sheets, etc). The deposition chamber uses a cryogenic pump and can achieve very low pressure (< 10-6 Torr), ensuring high-purity metal films. The evaporator features dual resistively heated sources and a rotating substrate table to ensure uniform depositions across large-area substrates....
Scanning Electron Microscope
General purpose SEM that performs imaging of surface morphology of conductive samples, using electrons as the beam. Useful for studying surfaces with sub-micrometer structures….
Infrared Spectro/Microscopy (ISMI) Beamline
ISMI (Infrared Spectro/Microscopy) beamline provides a state-of-the-art Fourier Transform IR spectrometer and microscope to supply diffraction-limited spatial resolution to an ever-widening range of infrared spectroscopy experiments. Synchrotron based source provides a versatile infrared radiation that covers a spectral range from 10000 to 10 cm-1 and has considerable brightness advantages over conventional (thermal) IR sources enabling IR experiments with high resolution and studies of extremely small or diluted samples….
Surface, Interface and Nanostructure Science (SINS) Beamline
SINS facility uses a bending magnetic beamline to deliver photon with an energy range from 50-1200 eV for end-station to cover the K-edges of light elements (C, N, and O) and L-edges of transition metals, and M-edges of part of rare earth metals, with user selectable linear and circular polarization for soft x-ray photon. There are two measurement chambers (main chamber and XMCD chamber) in the end-station, which are designed for X-ray photoelectron spectroscopy (XPS), angle-resolved photoemission (ARPES), X-ray absorption spectroscopy (XAS), X-ray linear dichroism (XMLD) and X-ray magnetic circular dichroism (XMCD) experiments….
Series Laser Micro Machining System
This high end femto laser is used for precision cutting/drilling and ablating of materials by microns….
CIGS R&D Lab Scale Scribing Equipment
For department/faculty use only.
The hybrid scribing system is used for P1, P2 and P3 pattering and preparing of thin film and tandem mini-modules of sizes up to 30 cm × 30 cm. The machine features both laser and mechanical scribing methods to prepare thin film mini-modules and mimics the scribing processes commonly used in CIGS PV module production….
Versatile R&D Laser System
The ILS LT is an R&D laser processing workstation for high-precision applications in PV. This tool can be used for several process applications for making high-efficiency solar cells, including contact opening, selective mask processing or edge/junction isolation, wafer drilling, wafer cutting, silicon shadow mask fabrication and laser marking for substrate ID tracking purposes….
UV Preconditioning Chamber and Accessories
A chamber to perform UV light soaking as an accelerated degradation test for PV modules….
Thermal Laser Separation Wafer Dicing Machine
This advanced tool uses thermally induced mechanical stress to separate brittle semiconductor materials like silicon wafers. As opposed to conventional laser cutting, no bulging and no formation of particles occur, because the substrate is merely heated and not vaporised. The mechanical stability of TLS-processed solar cells is significantly greater than conventionally processed solar cells….
Agilent 6540 LC QToF
LC-QTOF is a versatile analytical technique that enables the identification and characterization of unknown compounds in complex samples. It is not limited to a specific research area and finds applications in various scientific disciplines….
Agilent LC-QQQ 6495C
LC-QQQ is an analytical technique commonly used for targeted quantitative analysis in various fields. It is particularly useful in areas such as environmental monitoring, food safety testing, and clinical research….
VSM (Vibrating Sample Magnetometer)
The VSM is used for measuring magnetic properties such as DC characterisation….
Molecular Beam Epitaxy (MBE) System
The fully integrated MBE system allows deposition of hetero-structures and semiconductors. IV and II-VI group deposition chambers are integrated with transfer chamber and load lock. The system has 5 ports for each chamber….
Bruker Icon Atomic Force Microscope
AFM utilises imaging techniques for surface analysis. It allows accurate and non-destructive measurements of the topography, electrical, and magnetic properties of a sample surface with high resolution….
SQUID (Superconducting QUantum Interference Device) Magnetometer
This equipment uses SQUID-based magnetometry / susceptibility to provide a stable magnetic field for material characterisation….
Scanning MOKE (Magneto-Optical Kerr Microscope & Magnetometer)
This equipment is used for visualisation of magnetic domains and magnetization processes as well as for optically recording magnetization curves qualitatively on all kinds of magnetic materials, including bulk specimens like sheets or ribbons, magnetic films and multilayers, patterned films or micro- and nanowires….
Reactive Ion Etching
A plasma reactor for the dry etching of silicon and silicon oxide using photoresist masks….
ICP-RIE Plasma Etcher SI 500
The high end plasma etching system SI 500 uses an inductively coupled plasma with low ion energy for low damage etching and nano structuring….
Maskless Laser Writer
This device is used for laser UV lithography, direct writing for optical mask production and direct wafer patterning….
Mask Aligner with DUV Option
A mask aligner for UV lithography….
Chemo-Mechanical Polishing (CMP)
The CMP system is used for metal and dielectric planarization such as Cu Al, SiO2, SiN. It is able to accommodate polishing for coupon size up to 2 cm as well as wafer size up to 8 inches, with a finishing surface roughness of 1 nm….
Tescan FIBSEM System
The FIBSEM system is used to capture the microstructure image of materials….
Hitachi Regulus FESEM
The FESEM system is used to capture the microstructure image of materials….
Hitachi Regulus FESEM w EDX
The FESEM system is used to capture the microstructure image of materials….
Raman (Micro PL and Raman)
The Raman microscope acquires detailed chemical images and highly specific Raman data from discrete points. It analyses both large volumes and traces of material….
E-beam Lithography (Raith)
This is a fast, high-resolution, automated wafer and multi-sample exposures electron beam lithography tool….
Furnace (Horizontal)
Furnace system for wet and dry oxidation in the temperature range of 200 to 1000 degree Celsius…
Park Systems AFM (Atomic Force Microscope)
AFM utilises imaging techniques for surface analysis. It allows accurate and non-destructive measurements of the topography, electrical, and magnetic properties of a sample surface with high resolution….
TEM 2010F
The transmission electron microscope is a microscope whereby a beam of electrons is transmitted through an ultra-thin specimen, interacting with the specimen as it passes through. An image is formed from the interaction of the electrons transmitted through the specimen. The image is magnified and focused onto an imaging device, such as a fluorescent screen, on a layer of photographic film, or to be detected by a sensor such as a CCD camera….
TEM 2800
The JEM-2800 is an advanced workhorse 200 kV transmission electron microscope with a Schottky-type field emission electron source. This multi-purpose S/TEM employs an user-friendly, high-stability operating system for high-resolution imaging in TEM (including diffraction modes) and STEM (imaging and EDS). Equipped with a TMP vacuum system, the JEM-2800 is particularly suited for fast screening of multiple samples….
SEM Sigma 300
The scanning electron microscope utilizes a focused beam of electrons to scan the surface of a sample. As the electron beam interacts with the specimen, it generates signals such as secondary electrons, backscattered electrons, and characteristic X-rays. These signals are detected and processed to create an image, revealing the topography, composition, and other features of the sample at high magnifications….
ICP Etch Cluster with 3 Modules / Plasma
The 3-chamber-modules advanced dry etching cluster system is used for micro- and nanomachining of various materials, with 8” wafer size, 300 mm diameter alumina discharge chamber, up to 8 mass flow controlled gas lines for each module and a minimum base pressure of 1×10-6 torr….
AJA Metal & Dielectric Sputtering System
This system uses close proximity physical vapour deposition with magnetron technology. The target-to-substrate distance is adjustable between 50-100 mm. The system accepts 3” diameter target size, various sample sizes and a maximum of 8” wafer….
Etcher for Magnetic Materials – SCIA
The SCIA Coat 200 is designed for homogeneous coating of high precision optics such as X-ray mirrors and optical filters with the technology of Dual Ion Beam Deposition (DIBD). The system is also equipped with a RF350-e ion beam source for etching process….
Laser Writer System – TLG (Heidelberg)
Heidelberg DWL 66+ laserwriter is a high resolution pattern generator for direct writing and mask making….
Magnetic Annealing System
This system applies an external magnetic field during the annealing process, which serves as an effective process to enhance the performance of magnetic devices and materials….
Mask Aligner MA8
The Mask Aligner 8 system is a precision photolithography tool used in the fabrication of microelectronic devices. It aligns a photomask with a substrate, typically a silicon wafer, and then exposes the substrate to ultraviolet (UV) light. This process transfers the mask’s pattern onto a light-sensitive photoresist layer on the substrate….
Atomic Layer Deposition System (ALD)
This system is used for the atomic layer deposition (ALD) of metal nitrides, oxides and sulphides with thermal and plasma processes….
Aberration-corrected Analytical S/TEM
The JEM-ARM200F is a 200 kV cold field-emission, probe-corrected transmission electron microscope with a STEM resolution of 0.078 nm and TEM resolution of 0.1 nm. It also has an energy-dispersive X-ray detector and dual energy loss spectrometers that can form elemental maps at atomic resolution, and a fast CMOS camera. With its probe aberration corrector and ultra-high-resolution pole piece it is particularly suited to STEM imaging and analysis….
Ar+ Ion Miller (TEM)
The Fischione 1051 TEM Mill allows for the preparation of TEM lamella samples through dual argon ion beams. Equipped with a touchscreen interface and camera, it can be operated through digital inputs as well as remotely….
Ar+ Ion Miller (TEM/SEM)
The Leica EM RES102 has two saddlefield ion sources with variable ion energies, with the capability of mounting a variety of samples for argon ion milling, including SEM and TEM samples….
Ar+ Ion Slicer
The Ion Slicer can prepare thin-film specimens without solvents or chemicals and requires no prior treatment of the specimen other than rectangular slicing (no disc grinding or dimple grinding)…
Ga+ Sample Preparation Focused Ion Beam
The FEI Helios 450S FIB is a dual beam Ga+ ion & electron microscope with high-resolution topographical imaging and patterning capabilities. The electron beam is primarily used for surface characterization, while the ion beam is used for top-down fabrication tasks such as TEM lamella preparation, cross-section failure analysis, and nanoscale surface modification. The stability of the low voltage ion beam and chamber cleaning attachments reduces contamination and amorphization vital for S/TEM analysis….
He+/Ne+ High-resolution FIB
The Orion NanoFab Helium Ion Microscope (HIM) operates using ionized Helium or Neon gases rather than electrons for imaging and milling of materials. With the significantly smaller interaction volume, alongside the smaller de Broglie wavelength, the HIM can achieve finer spatial resolution and larger depth-of-field compared to a FE-SEM. Nanomachining fabrication with sub-10 nm feature sizes is achievable through lighter He ions, while faster milling is operated through heavier Ne ions….
E-beam/Thermal Evaporator
This UHV deposition system is capable of producing good quality thin films of metals, alloys and their multilayers Able to handle 8” wafers size. Targets E-beam: Ti, Cr, Al Thermal: Au, Cu…
Raman Spectrometer
The Raman microscope offers advanced confocal imaging capabilities in 2D and 3D. The true confocal Raman microscope enables the most detailed images and analyses to be obtained with speed and confidence. With guaranteed high performance and intuitive simplicity, the LabRAM HR Evolution is the ultimate instrument for Raman spectroscopy. They are widely used for standard Raman analysis, PhotoLuminescence (PL), Tip Enhanced Raman Spectroscopy (TERS) and other hybrid methods….
XRD (Thin Film)
D8 ADVANCE provides a range of hardware and software solutions for X-ray diffraction and scattering applications, including phase identification, quantitative phase analysis, micro-structure and crystal structure analysis….
DSC (Differential Scanning Calorimetry) Instrument
The DSC instrument allows user to measure the heat flow into (or out of) a sample when it is heated or cooled, and use the data to determine its melting point, Tg, etc….
TGA (ThermoGravimetric Analysis) Instrument
The TGA instrument allows the user to measure the mass change in a sample when it is heated at a constant rate, at a constant temperature, or both….
STA (Simultaneous Thermal Analysis) Instrument
The STA instrument combines function of the TGA and the DSC. It allows user to measure at the same time both the heat flow and the mass change of a sample when it is heated….
Bruker Stylus Profilometer
The stylus profilometer allows user to scan the surface of a sample with a stylus (i.e. contact method) and then characterize its surface roughness, or determine the depth of a groove, etc….
KLA Tencor Stylus Profilometer
The stylus profilometer allows user to scan the surface of a sample with a stylus (i.e. contact method) and then characterize its surface roughness, or determine the depth of a groove, etc….
UV-Vis Spectrometer
The UV-Vis spectrometer allows user to shine light in the UV-visible range through a sample and measure its absorbance or transmittance spectrum….
UV-Vis Spectrometer with an Integrating Sphere
The UV-Vis spectrometer allows user to shine light in the UV-visible range through a sample and measure its absorbance or transmittance spectrum. The integrating sphere expands its capability allowing measurement of reflectance spectrum (diffuse or specular)….
Agilent FTIR Spectrometer, with ATR Accessory
The FTIR spectrometer allows the user to shine infrared light at a sample and measure its absorbance or transmittance spectrum. The ATR accessory enables simpler and quicker measurement compared with the traditional methods (with some trade-off)….
PerkinElmer FTIR Spectrometer, with ATR Accessory
The FTIR spectrometer allows the user to shine infrared light at a sample and measure its absorbance or transmittance spectrum. The ATR accessory enables simpler and quicker measurement compared with the traditional methods (with some trade-off)….
Fluorescence Spectrometer
The fluorescence spectrometer allows user to shine light from UV-Vis range at a sample and collect its fluorescence spectrum….
Multipurpose Atomic Force Microscope
The Park NX10 AFM features a True Non-Contact™ scan Mode that produces high resolution and accurate data by preventing destructive tip-sample interaction during a scan. Its compact and rigid ‘Step-and-Scan’ enables programmable multiple region imaging….
4″ Chemical Vapour Deposition
Split tube furnaces can be used for a wide range of applications where precise temperature control and the ability to easily insert and remove samples are important. Compact design for minimum space requirement….
2″ Chemical Vapour Deposition
Split tube furnaces can be used for a wide range of applications where precise temperature control and the ability to easily insert and remove samples are important. Compact design for minimum space requirement….
Graphene CVD
Graphene CVD is a process used to produce high-quality graphene sheets. This technique involves depositing carbon atoms onto a substrate, typically copper, at high temperatures. A carbon-containing gas, such as methane, is introduced into a reaction chamber where it decomposes on the hot substrate, allowing the carbon atoms to arrange themselves into a single layer of graphene. This method is preferred for its ability to produce large-area graphene with excellent electronic properties, making it suitable for applications in electronics, sensors, and other advanced technologies….
Heidelberg Laser Writer
Heidelberg laser writer is a high resolution pattern generator for direct writing and mask making….
Mask Aligner – T Lab
The Mask Aligner MJB4 system is a precision photolithography tool used in the fabrication of microelectronic devices. It aligns a photomask with a substrate, typically a silicon wafer, and then exposes the substrate to ultraviolet (UV) light. This process transfers the mask’s pattern onto a light-sensitive photoresist layer on the substrate….
Surface Stylus Profiler
Stylus profilometer allows user to scan the surface of a sample with a stylus (i.e. contact method) and then characterize its surface roughness, or determine the depth of a groove, etc….
Spin Coater
Fully programmable and user-friendly, the Cee® 200X features the accuracy and repeatability needed to eliminate processing variability from photoresist and thin film deposition processes….
ICP Etch System SI 500
An ICP etch system that utilizes plasma generated by inductively coupled sources to precisely etch materials on substrates through ion bombardment, ensuring high precision and control….
Plasma Etch System
This system enables the cleaning of surfaces, such as before bonding, soldering or gluing, as well as the activation of surfaces before printing, varnishing or gluing. Gases available are Ar, O2 and N2….
UV Ozone Cleaner
The ZONETEM II utilizes vacuum-controlled UV irradiation to gently eliminate hydrocarbon contamination for electron microscopy imaging….
Plasma Cleaner
The Gatan Solarus II is a plasma cleaning system for removing organic surface contaminants through user-defined gas-flow plasma….
Dry Pumping Station
This station is used to store TEM holders….
Digital Automated
The Olympus DSX1000 is an upright fully digital microscope with automated xyz and focusing functions. The tilting head allows sample imaging from multiple angles and lens can be selected for a variety of field-of-views….
Inverted Motorized
The ECLIPSE Ti2 is an inverted microscope delivering 25 mm field of view with stable, drift-free platform for high-speed imaging applications….
Scanning Electron Microscope with Lithography
Zeiss EVO 10 is a 3-in-1 tool, featuring EBL, FESEM and EDX functions within the same tool. At challenging imaging conditions, the electron emitter users benefit from up to 10 times more beam brightness, resulting in an enhanced image resolution and contract. The SmartEDX, which is designed to acquire spatially resolved elemental information from the sample surfaces, obtains its highest throughput at 129 keV energy resolution at typical SEM operating conditions….
Modular Dry Room
This is an advanced battery research lab, equipped with 2 dry rooms (Relative Humidities 1% and 20%) designed for fabrication of batteries (electrodes and slurry) and a battery testing room, capable of galvanostatic charge-discharge tests up to 100 mA for coin, pouch and cylindrical cells….
Target Surfacing System
The Leica EM TXP is a target preparation device for milling, sawing, grinding, and polishing samples prior to examination by SEM, TEM, and LM techniques….
Ultramicrotome
The Leica Ultracut UCT ultramicrotome is an instrument commonly used to prepare TEM samples. It uses either a glass or diamond knife to cut ultra thin sections of specimens embedded in epoxy. The sections are approximately 60 to 100 nanometers in thickness and 0.5 to 3 mm in width and can be stained and mounted onto TEM grids for viewing….
Bruker Fastscan Atomic Force Microscope
The Bruker AFM is able to operate in 2 modes, ICON AFM Scanner and Fast Scan ADM scanner. The fast scan mode provides X-Y tip velocity of >2 mm per sec, hence is able to scan a sample within a short span of 15 mins. There are also various modes to use, such as the nanomechanical mapping, nanomanipulation, surface potential etc….
Mask Aligner – Science
MJB4 mask aligner is equipped with a reliable, high precision alignment and high resolution printing capability in the submicron range. It offers fast and highly accurate alignment with SUSS singlefield or spitfield microscope….
Ultra High Vacuum Sputtering System
6 magnetron sputtering sources (3 DC and 3 AC) mainly for deposition of metals and dielectrics. The DC and RF generators support up to 750 W and 300 W respectively with auto-matching unit. Sample holder is able to hold small piece samples, up to full 8 inches in diameter wafer, with rotation and RF/DC biasing capabilities. A heater jacket is provided for chamber bake-out to achieve UHV pressure….
Electron Beam Lithography System
The JEOL JBX-6300FS EBL is a high throughput system, running at 25 keV, 50 keV and 100 keV acceleration voltages. It has mulit cassette loader (up to 10 samples) and is able to process piece part samples and full 4 inches diameter substrates. The minimum linewidth achievable in our cleanroom environment is 12 nm with sticking accuracy of less than +/- 20 nm at 100 keV. It comes with Genisys-Beamer software to assist in high resolution patterning by proximity effects….
Field Emission Scanning Electron Microscope
The FEI Verios 460 is one of the leading extreme high resolution SEM family. It provides sub-nanometer resolution from 1~30 keV and enhanced contract needed for precise measurements on materials in advanced semiconductor manufacturing and advanced materials science applications. Our system is equipped with various detectors (in-column detector, ICD for high resolution imaging, STEM detector for scanning transmission electron microscopy of thin membrane etc). It also possesses electron back scattered diffraction, EBSD for crystal orientation mapping….
E-Beam Evaporator (AJA)
The AJA electron beam evaporator system is equipped with 6x 15cc crucibles for depositing 6 materials within the same load-lock system….
Raman/IR Photoluminescence Imaging Microscope
The Alpha 300R offers unique ability to acquire chemical information non-destructively. It allows you to observe and analyse the distribution of different phases within a sample in ambient conditions without the need to specially prepare your samples. In addition to chemical compounds, analysis of physical properties such as crystallinity or materials stress are also possible….
Gas Cell Protochips
The Protochips Atmosphere allows the in-Operando study of materials under realistic environmental conditions. Based on a TEM holder closed-cell design, Atmosphere is a fully automated system that includes a computer controlled gas manifold and a feature-rich software interface….
Measuring Microscope
The device has excellent versatility and high performance for measurements of parts and electrical components, with sub-micron precision….
TEM Heating and Biasing Holder
The Lightning in-situ TEM biasing & heating holder provides real-time information under a controllable electrical and thermal environment in the microscope….
Cryo-transfer
The Elsa cryo-transfer holder is a single-tilt liquid nitrogen holder designed for the frost-free transfer of a sample at liquid nitrogen temperature….
Vac-transfer/Cryo
The Mel Build Defend Atmos Defend holder incorporates a specially designed vacuum transfer system and a mechanical drift cancellation controller. The holder can be tilted along two axes and cooled down to -160°C….
Muffle Furnace 2
The muffle furnace is designed for high-temperature heating and thermal processing in a controlled environment. It has a sealed chamber that isolates the heating elements from the material being processed, minimizing contamination and ensuring uniform temperature distribution. …
Drop Shape Analyzer 25E
DSA25 is an easy-to-use, reliable instrument for measuring contact angle. The methods could be by sessile drop, double sessile drop, pendent drop, etc….
Drop Shape Analyzer 30M
DSA30 was specially designed to investigate the contact angle on surfaces which require very small drops for analyze. The methods could be by sessile drop, double sessile drop, pendent drop, etc….
Inductively Coupled Plasma – Optical Emission Spectrometry (ICP-OES)
This device currently only accept aqueous sample. Sample digestion service is not available. The sample concentration is suggested to be diluted to ppb or ppm level and to be filtered before test if there are particles….
Malvern Panalytical Zetasizer
This device is an advanced system for the measurement of particle and molecular size, particle charge and particle concentration. The measurable range for particle size test: 0.3 nm to 10 μm….
Flash Chromatography
This is a high-performance, versatile flash purification system designed for broad requirements in drug discovery and research laboratories….
Fluorescence Spectrophotometer
This system includes both steady-state and time-resolved dual capabilities. …
Fourier-transform Infrared Spectroscopy (FTIR)
Attenuated Total Reflectance (QATR 10, diamond crystal) for direct measurement of liquid, film, and powder samples….
High-Performance Liquid Chromatography-Mass Spectrometry (HPLC-MS)
LC–MS is an analytical chemistry technique that combines the physical separation capabilities of liquid chromatography (or HPLC) with the mass analysis capabilities of mass spectrometry (MS)…
Shimadzu UV-Vis-NIR Spectrophotometer
It has measurement capability in the UV, visible and up to 3,300 nm in the near-IR region allows for characterizing samples (including solids, powders, wafers, films and liquids). It has a cuvette holder and solid sample holder….
Mettler Toledo UV-Vis-NIR Spectrophotometer
The system is equipped with a cuvette platform, and micro-volume platform for fast measurement (seconds) of µL liquid or films….
Potentiostat
The system has multichannel capabilities to run multiple experiments simultaneously. Every individual channel is independent….
Scanning Electrochemical Systems
A multifunctional compact scanning system equipped with a Scanning Electrochemical Microscopy (SECM), a Scanning Vibrating System (SVET), a LEIS (Localised Electrochemical Impedance Spectroscope) and a Scanning Kelvin Probe (SKP)….
Anton Paar Zetasizer
The system allows measurement of the zeta potential down to a few millivolt at the solid/liquid interface by means of streaming potential and streaming current measurement. …
Dynamic Mechanical Analyzer – Science Blk 9
The equipment is capable of measuring the mechanical properties of samples (in air as well in liquid media) under controlled environmental conditions of temperature, pH and relative humidity (RH)….
Muffle Furnace
The furnance is to perform chemical reactions, annealing of materials, devices in ambient conditions….
Scanning Laser Photolithography System
The laser writer tool is designed for definition of planar geometries and for surface diagnostics, in applications where maximum resolutions down to 0.7 um are required. The system transforms a laser beam into a controlled writing tool for photolithographic mask fabrication or for direct in situ processing on planar substrates. This also eliminates the requirement of mask for optical lithography….
Deep Reactive Ion Etcher
The DRIE uses special gases for standard industry semiconductor etching purpose. It is able to etch the samples in 2 modes, Bosch (chiller mode) and the Cryo (liquid nitrogen mode which could go to sub 20°C). Apart from being able to etch silicon substrates, it could be used to etch oxides and nitrides and provide good selectivity. It is also equipped with a load-lock and the processes are automated and user-friendly….
TEM 3010
The transmission electron microscope is a microscope whereby a beam of electrons is transmitted through an ultra-thin specimen, interacting with the specimen as it passes through. An image is formed from the interaction of the electrons transmitted through the specimen. The image is magnified and focused onto an imaging device, such as a fluorescent screen, on a layer of photographic film, or to be detected by a sensor such as a CCD camera….
Denis Baranov
An expert from Institute for Functional Intelligent Materials (I-FIM), Denis Baranov is the person to approach for queries involving in the area of Atomic force imaging, Scanning near field optical microscope, Fluorescent systems, and other commercial and specialized microscopy techniques…
Kristina Vaklinova
An expert from Institute for Functional Intelligent Materials (I-FIM), Kristina Vaklinova is the person to approach for queries involving in the area of Nanoscale heterostructures, Microscale heterostructures, Device fabrication…
Tan Xipeng
An expert from College of Design and Engineering, University Electron Microscopy Centre, APT Facility, Tan Xipeng is the person to approach for queries involving in the area of Brightfield, Widefield, Fluorescence, 3D imaging, Scanning Confocal, Spinning Disk confocal, Multiphoton, Live cell imaging, Calcium imaging, F-techniques, FRAP, FCS, FCCS, Image analysis, 3D visualisation, Experimental planning…
Jonathan Aristya Setyadji
An expert from College of Design and Engineering, University Electron Microscopy Centre, APT Facility, Jonathan Aristya Setyadji is the person to approach for queries involving in the area of Brightfield, Widefield, Fluorescence, 3D imaging, Scanning Confocal, Spinning Disk confocal, Multiphoton, Live cell imaging, Calcium imaging, F-techniques, FRAP, FCS, FCCS, Image analysis, 3D visualisation, Experimental planning…
Ang Han Siong
An expert from Centre for Advanced 2D Materials (CA2DM), Ang Han Siong is the person to approach for queries involving in the area of Nano device fabrication and characterisation based on 2D materials…
Sourav Mitra
An expert from Institute for Functional Intelligent Materials (I-FIM), Sourav Mitra is the person to approach for queries involving in the area of Surface analysis, Elemental and concentration analysis, Particle and molecular characterization, Separation and identification, Spectroscopy, Electrochemical analysis, Mechanical and thermal analysis…
Tummala Pinaka Pani
An expert from Institute for Functional Intelligent Materials (I-FIM), Tummala Pinaka Pani is the person to approach for queries involving in the area of Large-area growth of MoS2 nanosheets, Fabrication of two-dimensional transition metal dichalcogenides (TMDs), Chemical vapor deposition (CVD), Furnace management and operation…
Shi Jian
An expert from Faculty of Science, Centre for BioImaging Sciences (CBIS), CryoEM Facility, Shi Jian is the person to approach for queries involving in the area of CryoEm sample preparation, SEM and FIB, TEM, Cryo-TEM, CryoEM, TEM-Material science, SPA, Tomography, MicroED, HR-TEM, STEM, 4D-STEM…
Chen Musen
An expert from Institute for Functional Intelligent Materials (I-FIM), Chen Musen is the person to approach for queries involving in the area of Surface analysis, Elemental and concentration analysis, Particle and molecular characterization, Separation and identification, Spectroscopy, Electrochemical analysis, Mechanical and thermal analysis…
Yang Fengzhen
An expert from College of Design and Engineering, Materials Science and Engineering, Electron Microscopy Facility, Yang Fengzhen is the person to approach for queries involving in the area of Transmission electron microscopy (TEM)…
Shen Jingjing
An expert from College of Design and Engineering, Materials Science and Engineering, Shen Jingjing is the person to approach for queries involving in the area of Scanning Electron Microscopy (SEM)…
Chen Qun
An expert from College of Design and Engineering, Materials Science and Engineering, Chen Qun is the person to approach for queries involving in the area of X-Ray Diffraction (XRD)…
Henche Kuan
An expert from College of Design and Engineering, Materials Science and Engineering, Henche Kuan is the person to approach for queries involving in the area of Thermal analysis, Stylus profilometry, Spectrometry (UV-Vis), Spectrometry (FTIR), Spectrometry (Fluorescence)…
Ashley Xu
An expert from College of Design and Engineering, Materials Science and Engineering, T11 Shared Facilities, Electron Microscopy Facility, Ashley Xu is the person to approach for queries involving in the area of Helium ion microscopy, Material science, Optical spectroscopy, Nanofabrication, Electron microscopy, 2D materials, 2D material characterization…
Chiam Taw Chun
An expert from College of Design and Engineering, Materials Science and Engineering, T11 Shared Facilities, Chiam Taw Chun is the person to approach for queries involving in the area of Material science, Nanofabrication, Electrical characterisation, 2D materials…
Li Haobo
An expert from College of Design and Engineering, Materials Science and Engineering, T11 Shared Facilities, Li Haobo is the person to approach for queries involving in the area of Materials Science, Thin film and 2D materials deposition and characterization, Photolithography…
Tihomir Marjanovic
An expert from College of Design and Engineering, Materials Science and Engineering, T11 Shared Facilities, Tihomir Marjanovic is the person to approach for queries involving in the area of Material Science, Precise instrumentation, System optimization in nanotechnology and electrical control system…
Jian Linke
An expert from College of Design and Engineering, Materials Science and Engineering, T11 Shared Facilities, Jian Linke is the person to approach for queries involving in the area of Microfabrication, Lithography, SEM imaging, ICP dry etching, Optical mask making, Thin film deposition(eBeam & Thermal)…
Gianluca Grenci
An expert from Mechanobiology Institute, Gianluca Grenci is the person to approach for queries involving in the area of Si micromachining, Photo-patterning…
Mohammed Ashraf
An expert from Mechanobiology Institute, Mohammed Ashraf is the person to approach for queries involving in the area of Si micromachining, Photo-patterning…
Patrick Tang
An expert from College of Design and Engineering, E6 NanoFab, Patrick Tang is the person to approach for queries involving in the area of General tool management…
Loh Fong Leong
An expert from College of Design and Engineering, E6 NanoFab, Loh Fong Leong is the person to approach for queries involving in the area of General tool management…
Thomas Ang
An expert from College of Design and Engineering, E6 NanoFab, Thomas Ang is the person to approach for queries involving in the area of Microelectronic fabrication…
Htike Aung
An expert from College of Design and Engineering, E6 NanoFab, Htike Aung is the person to approach for queries involving in the area of Microelectronic fabrication…
David Xu Baochang
An expert from College of Design and Engineering, E6 NanoFab, David Xu Baochang is the person to approach for queries involving in the area of Microelectronic fabrication…
Xiao Yun
An expert from College of Design and Engineering, E6 NanoFab, Xiao Yun is the person to approach for queries involving in the area of Lithography…
Lin Zhong Guan
An expert from College of Design and Engineering, E6 NanoFab, Lin Zhong Guan is the person to approach for queries involving in the area of Microelectronic fabrication…
Chua Kut Tiong
An expert from College of Design and Engineering, E6 NanoFab, Chua Kut Tiong is the person to approach for queries involving in the area of Microelectronic fabrication…
Linn Linn
An expert from College of Design and Engineering, E6 NanoFab, Linn Linn is the person to approach for queries involving in the area of Semiconductor device cross section analyses, Advanced coating thickness and structure uniformity determination, Small contamination feature geometry and elemental composition measurement…
Musni
An expert from College of Design and Engineering, E6 NanoFab, Musni is the person to approach for queries involving in the area of Raman microscopy…
Manohar Lal
An expert from College of Design and Engineering, E6 NanoFab, Manohar Lal is the person to approach for queries involving in the area of Sub-10nm nanofabrication and nanolithography…
Yang Ping
An expert from Singapore Synchrotron Light Source, Yang Ping is the person to approach for queries involving in the area of Crystallography, Materials science…
Agnieszka Banas
An expert from Singapore Synchrotron Light Source, Agnieszka Banas is the person to approach for queries involving in the area of Fourier Transform Infrared spectroscopy and microscopy (FTIR), O-PTIR non-contact submicron visible probe infrared spectroscopy, Nanoscale infrared spectroscopy and imaging, Synchrotron Induced X-ray Emission (SRIXE), Proton Induced X-ray Emission (PIXE), X-ray absorption fine structure (XAFS), Statistical multivariate methods for spectral data evaluation, dimension reduction…
Yu Xiaojiang
An expert from Singapore Synchrotron Light Source, Yu Xiaojiang is the person to approach for queries involving in the area of Surface science, Condensed matter physics…
Diao Caozheng
An expert from Singapore Synchrotron Light Source, Diao Caozheng is the person to approach for queries involving in the area of Surface science, Condensed matter physics…
Selvaraj Venkataraj
An expert from Solar Energy Research Institute of Singapore, Selvaraj Venkataraj is the person to approach for queries involving in the area of Solar cell device fabrication and characterization, Optical coatings, Thin film deposition, Magnetron sputtering…
Choi Kwan Bum
An expert from Solar Energy Research Institute of Singapore, PV Devices Characterisation Group, Choi Kwan Bum is the person to approach for queries involving in the area of Photovoltaic cell characterisation…
Srinath Nalluri
An expert from Solar Energy Research Institute of Singapore, Building Integrated Photovoltaics, Srinath Nalluri is the person to approach for queries involving in the area of PV module fabrication, PV module testing and simulation…
Carlos Clement
An expert from Solar Energy Research Institute of Singapore, Building Integrated Photovoltaics, Carlos Clement is the person to approach for queries involving in the area of PV module fabrication, PV module characterisation, simulation and testing…
Aziz Nairi
An expert from Solar Energy Research Institute of Singapore, PV Module Characterisation and Reliability, Leow Shin Woei is the person to approach for queries involving in the area of PV module fabrication, PV module characterization and testing…
Ison Jeffrey Garcia
An expert from Solar Energy Research Institute of Singapore, Ison Jeffrey Garcia is the person to approach for queries involving in the area of Laser processing – Photovoltaic solar cells…
Per Poh Geok
An expert from NUS Environmental Research Institute, Mass Spectrometry Lab, Per Poh Geok is the person to approach for queries involving in the area of Chromatography data acquisition and analysis, Method development using chromatography techniques…
Siah Ke Yee
An expert from NUS Environmental Research Institute, Mass Spectrometry Lab, Siah Ke Yee is the person to approach for queries involving in the area of Chromatography data acquisition and analysis, Method development using chromatography techniques…
Tony Wong
An expert from Centre for Quantum Technologies, Tony Wong is the person to approach for queries involving in the area of Microstructure fabrication, Micro machining, Precision manufacturing…
Tan Shengdong
An expert from College of Design and Engineering, Electron Microscopy Facility, Tan Shengdong is the person to approach for queries involving in the area of SEM, TEM, STEM, FIB, EDS, EELS…
Yao Bingqing
An expert from College of Design and Engineering, Electron Microscopy Facility, Yao Bingqing is the person to approach for queries involving in the area of SEM, TEM, STEM, FIB, EDS, EELS…
Zhou Xin
An expert from College of Design and Engineering, Electron Microscopy Facility, Zhou Xin is the person to approach for queries involving in the area of SEM, TEM, STEM, FIB, EDS, EELS…
Chung Jing Yang
An expert from College of Design and Engineering, Materials Science and Engineering, T11 Shared Facilities, Electron Microscopy Facility, Chung Jing Yang is the person to approach for queries involving in the area of SEM, TEM, STEM, FIB, EDS, EELS…