The Versa 3D DualBeam FEG FIB-SEM combines a focused Ga ion beam with a high-resolution field-emission electron gun. Owing to a large chamber allowing up to 6″ industry wafers with full rotation, the Versa 3D provides enhanced 2D and 3D materials characterization and analysis for a wide range of material science and industry-related samples….
This multichamber physical vapour deposition (PVD) sputtering platform is designed to handle silicon wafers and glass panes. The SV-540 is a state-of-the-art machine having dedicated chambers for the sputtering of metallic, dielectric and TCO/TMO layers. The processing chambers are equipped with planar magnetron sources for DC sputtering of metals, oxides and oxynitrides in the reactive mode, and with a cylindrical dual-magnetron source and planar sources for pulsed DC sputtering of dielectrics and TCOs/TMOs, with substrate heating up to 500 degree Celsius….
A versatile AFM that can capture images of air-sensitive materials that are inherently distortion-free and reproducible. Equipped with easy tip exchange combined with SmartScan software’s one-click imaging and pre-programmed advanced modes. …
Benchtop semi-auto wire bonder …
This photoluminescence imaging tool can perform luminescence study of silicon solar cells and wafers. It gives visual information about the defects on the sample….
This inline sputtering tool from FHR Anlagenbau, Germany has three planar magnetron sources, whereby two sources are connected to a DC power supply for DC sputtering of metal layers, while the third source is connected to an RF power supply for the deposition of dielectric films….
Used for the automatic soldering of metal ribbons onto solar cells and interconnecting solar cells into strings. SERIS’ customised TT1800 stringer is capable of interconnecting standard silicon solar cells with up to 6 busbars as well as interdigitated-back-contact solar cells. Both full-size cells and half-cut cells can be processed….
This high end femto laser is used for precision cutting/drilling and ablating of materials by microns….
The Echo 525 Liquid Handler is a rapid acoustic liquid handler designed specifically for biochemical and genomics reagent transfer….
For department/faculty use only.
The hybrid scribing system is used for P1, P2 and P3 pattering and preparing of thin film and tandem mini-modules of sizes up to 30 cm × 30 cm. The machine features both laser and mechanical scribing methods to prepare thin film mini-modules and mimics the scribing processes commonly used in CIGS PV module production….
The ILS LT is an R&D laser processing workstation for high-precision applications in PV. This tool can be used for several process applications for making high-efficiency solar cells, including contact opening, selective mask processing or edge/junction isolation, wafer drilling, wafer cutting, silicon shadow mask fabrication and laser marking for substrate ID tracking purposes….
This advanced tool uses thermally induced mechanical stress to separate brittle semiconductor materials like silicon wafers. As opposed to conventional laser cutting, no bulging and no formation of particles occur, because the substrate is merely heated and not vaporised. The mechanical stability of TLS-processed solar cells is significantly greater than conventionally processed solar cells….
A plasma reactor for the dry etching of silicon and silicon oxide using photoresist masks….
The high end plasma etching system SI 500 uses an inductively coupled plasma with low ion energy for low damage etching and nano structuring….
This device is used for laser UV lithography, direct writing for optical mask production and direct wafer patterning….
A mask aligner for UV lithography….
The CMP system is used for metal and dielectric planarization such as Cu Al, SiO2, SiN. It is able to accommodate polishing for coupon size up to 2 cm as well as wafer size up to 8 inches, with a finishing surface roughness of 1 nm….
This is a fast, high-resolution, automated wafer and multi-sample exposures electron beam lithography tool….
Furnace system for wet and dry oxidation in the temperature range of 200 to 1000 degree Celsius…
The 3-chamber-modules advanced dry etching cluster system is used for micro- and nanomachining of various materials, with 8” wafer size, 300 mm diameter alumina discharge chamber, up to 8 mass flow controlled gas lines for each module and a minimum base pressure of 1×10-6 torr….
This system uses close proximity physical vapour deposition with magnetron technology. The target-to-substrate distance is adjustable between 50-100 mm. The system accepts 3” diameter target size, various sample sizes and a maximum of 8” wafer….
The SCIA Coat 200 is designed for homogeneous coating of high precision optics such as X-ray mirrors and optical filters with the technology of Dual Ion Beam Deposition (DIBD). The system is also equipped with a RF350-e ion beam source for etching process….
Heidelberg DWL 66+ laserwriter is a high resolution pattern generator for direct writing and mask making….
This system applies an external magnetic field during the annealing process, which serves as an effective process to enhance the performance of magnetic devices and materials….
The Mask Aligner 8 system is a precision photolithography tool used in the fabrication of microelectronic devices. It aligns a photomask with a substrate, typically a silicon wafer, and then exposes the substrate to ultraviolet (UV) light. This process transfers the mask’s pattern onto a light-sensitive photoresist layer on the substrate….
This system is used for the atomic layer deposition (ALD) of metal nitrides, oxides and sulphides with thermal and plasma processes….
The Fischione 1051 TEM Mill allows for the preparation of TEM lamella samples through dual argon ion beams. Equipped with a touchscreen interface and camera, it can be operated through digital inputs as well as remotely….
The Leica EM RES102 has two saddlefield ion sources with variable ion energies, with the capability of mounting a variety of samples for argon ion milling, including SEM and TEM samples….
The Ion Slicer can prepare thin-film specimens without solvents or chemicals and requires no prior treatment of the specimen other than rectangular slicing (no disc grinding or dimple grinding)…
The FEI Helios 450S FIB is a dual beam Ga+ ion & electron microscope with high-resolution topographical imaging and patterning capabilities. The electron beam is primarily used for surface characterization, while the ion beam is used for top-down fabrication tasks such as TEM lamella preparation, cross-section failure analysis, and nanoscale surface modification. The stability of the low voltage ion beam and chamber cleaning attachments reduces contamination and amorphization vital for S/TEM analysis….
The Orion NanoFab Helium Ion Microscope (HIM) operates using ionized Helium or Neon gases rather than electrons for imaging and milling of materials. With the significantly smaller interaction volume, alongside the smaller de Broglie wavelength, the HIM can achieve finer spatial resolution and larger depth-of-field compared to a FE-SEM. Nanomachining fabrication with sub-10 nm feature sizes is achievable through lighter He ions, while faster milling is operated through heavier Ne ions….
This UHV deposition system is capable of producing good quality thin films of metals, alloys and their multilayers Able to handle 8” wafers size. Targets E-beam: Ti, Cr, Al Thermal: Au, Cu…
The stylus profilometer allows user to scan the surface of a sample with a stylus (i.e. contact method) and then characterize its surface roughness, or determine the depth of a groove, etc….
Heidelberg laser writer is a high resolution pattern generator for direct writing and mask making….
The Mask Aligner MJB4 system is a precision photolithography tool used in the fabrication of microelectronic devices. It aligns a photomask with a substrate, typically a silicon wafer, and then exposes the substrate to ultraviolet (UV) light. This process transfers the mask’s pattern onto a light-sensitive photoresist layer on the substrate….
Stylus profilometer allows user to scan the surface of a sample with a stylus (i.e. contact method) and then characterize its surface roughness, or determine the depth of a groove, etc….
Fully programmable and user-friendly, the Cee® 200X features the accuracy and repeatability needed to eliminate processing variability from photoresist and thin film deposition processes….
An ICP etch system that utilizes plasma generated by inductively coupled sources to precisely etch materials on substrates through ion bombardment, ensuring high precision and control….
This system enables the cleaning of surfaces, such as before bonding, soldering or gluing, as well as the activation of surfaces before printing, varnishing or gluing. Gases available are Ar, O2 and N2….
The ZONETEM II utilizes vacuum-controlled UV irradiation to gently eliminate hydrocarbon contamination for electron microscopy imaging….
The Gatan Solarus II is a plasma cleaning system for removing organic surface contaminants through user-defined gas-flow plasma….
This station is used to store TEM holders….
Zeiss EVO 10 is a 3-in-1 tool, featuring EBL, FESEM and EDX functions within the same tool. At challenging imaging conditions, the electron emitter users benefit from up to 10 times more beam brightness, resulting in an enhanced image resolution and contract. The SmartEDX, which is designed to acquire spatially resolved elemental information from the sample surfaces, obtains its highest throughput at 129 keV energy resolution at typical SEM operating conditions….
This is an advanced battery research lab, equipped with 2 dry rooms (Relative Humidities 1% and 20%) designed for fabrication of batteries (electrodes and slurry) and a battery testing room, capable of galvanostatic charge-discharge tests up to 100 mA for coin, pouch and cylindrical cells….
The Leica EM TXP is a target preparation device for milling, sawing, grinding, and polishing samples prior to examination by SEM, TEM, and LM techniques….
The Leica Ultracut UCT ultramicrotome is an instrument commonly used to prepare TEM samples. It uses either a glass or diamond knife to cut ultra thin sections of specimens embedded in epoxy. The sections are approximately 60 to 100 nanometers in thickness and 0.5 to 3 mm in width and can be stained and mounted onto TEM grids for viewing….
MJB4 mask aligner is equipped with a reliable, high precision alignment and high resolution printing capability in the submicron range. It offers fast and highly accurate alignment with SUSS singlefield or spitfield microscope….
6 magnetron sputtering sources (3 DC and 3 AC) mainly for deposition of metals and dielectrics. The DC and RF generators support up to 750 W and 300 W respectively with auto-matching unit. Sample holder is able to hold small piece samples, up to full 8 inches in diameter wafer, with rotation and RF/DC biasing capabilities. A heater jacket is provided for chamber bake-out to achieve UHV pressure….
The JEOL JBX-6300FS EBL is a high throughput system, running at 25 keV, 50 keV and 100 keV acceleration voltages. It has mulit cassette loader (up to 10 samples) and is able to process piece part samples and full 4 inches diameter substrates. The minimum linewidth achievable in our cleanroom environment is 12 nm with sticking accuracy of less than +/- 20 nm at 100 keV. It comes with Genisys-Beamer software to assist in high resolution patterning by proximity effects….
The AJA electron beam evaporator system is equipped with 6x 15cc crucibles for depositing 6 materials within the same load-lock system….
MPR-6 Plasma Asher used for the removal of photoresist or other non-metallic material on the substrates like silicon wafers using plasma created by exciting ions in a gas, usually oxygen and CF4….
Technol Magnetron Sputter coater works on physical vapor deposition (PVD) method of thin film deposition by the phenomenon of sputtering at high speed at low pressure. This involves ejecting material from a “target” that is source onto a “substrate” to form thin film/coatings on the substrate….
RYJ-600D series manual hot press is suitable for heating / melting of the materials at certain temperature at a certain pressure. Applicable to polymer materials, textiles etc. It can be used as a press to test the pressure resistance of various objects and so on….
The LPKF ProtoLaser U4 is a laser-based rapid prototyping system designed to provide precise and efficient prototyping capabilities for various applications, particularly in the field of PCB (printed circuit board) prototyping. The integrated UV laser can cut individual boards out of large boards with high precision and no stress, drill holes and microvias, and create openings in solder masks. It can cut and structure LTCCs, fired ceramics, ITO/TCO substrates, delicate prepregs, and laminated materials like FR4- or RF-specific substrates….
The SUSS MJB4 Mask Aligner is a widely recognized and commonly used mask aligner system in the field of microfabrication and semiconductor manufacturing. It is designed for precise alignment and exposure of photoresist-coated substrates to patterns on a photomask, enabling the transfer of patterns onto the substrate….
The muffle furnace is designed for high-temperature heating and thermal processing in a controlled environment. It has a sealed chamber that isolates the heating elements from the material being processed, minimizing contamination and ensuring uniform temperature distribution. …
The furnance is to perform chemical reactions, annealing of materials, devices in ambient conditions….
Thermo Scientific Vacutherm Vacuum Heating and Drying Ovens provide outstanding capabilities for fast and gentle drying. Excellent heat transfer and fast heating up minimizes operation time….
The QIDI Tech X-Max 3 is a large print size, industrial grade FDM 3D printer that is engineered for speed and precision…
The MA-3030 Impulse magnetizer is designed to produce a short duration high-field pulse for the purpose of magnetizing geological samples. The unit is rated to deliver accurate reproducible fields less than 60 KGauss, using the axial magnetizing coil for magnetic field ranges….
The Covance-2MPR is a multi-purpose O2 plasma process system with stable and homogeneous plasma discharge. It is usually used for applications such as PDMS-PDMS bonding, PDMS-glass bonding, surface chemistry modification (eg. hydrophilic/hydrophobic), surface cleaning, plasma grafting and cell attachment….
The Labcoter™ 3 (PDS 2010) is a Parylene Deposition System that applies a clear, uniform, and smooth Parylene coating of consistent thickness to a substrate. The coating is uniform and creates an extremely effective chemical barrier that is moisture resistant, mechanically strong, and exhibits a high dielectric constant. With Parylene deposition there is no intermediate liquid phase or separate curing cycle. The machine is typically designed to handle a variety of substrates, including metals, ceramics, plastics, and composites….
The VLS2.30 Desktop Laser is a compact and economical platform, designed to be an entry level laser system. It is mainly used for cutting planar acrylic….
The Trotec Speedy 360 laser cutter is a versatile and high-performance cutting and engraving machine. Its advanced laser technology offers fast and precise cutting of a wide range of materials….
The laser writer tool is designed for definition of planar geometries and for surface diagnostics, in applications where maximum resolutions down to 0.7 um are required. The system transforms a laser beam into a controlled writing tool for photolithographic mask fabrication or for direct in situ processing on planar substrates. This also eliminates the requirement of mask for optical lithography….
The DRIE uses special gases for standard industry semiconductor etching purpose. It is able to etch the samples in 2 modes, Bosch (chiller mode) and the Cryo (liquid nitrogen mode which could go to sub 20°C). Apart from being able to etch silicon substrates, it could be used to etch oxides and nitrides and provide good selectivity. It is also equipped with a load-lock and the processes are automated and user-friendly….
An expert from Institute for Functional Intelligent Materials (I-FIM), Denis Baranov is the person to approach for queries involving in the area of Atomic force imaging, Scanning near field optical microscope, Fluorescent systems, and other commercial and specialized microscopy techniques…
An expert from Institute for Functional Intelligent Materials (I-FIM), Kristina Vaklinova is the person to approach for queries involving in the area of Nanoscale heterostructures, Microscale heterostructures, Device fabrication…
An expert from Institute for Health Innovation & Technology (iHealthtech), Archana is the person to approach for queries involving in the area of Digital microscopy, High-resolution imaging, Image capture, Real-time observation, Acrylic laser cutting, Vacuum heating, Vacuum drying, , Plasma treatment, Laser microscopy, Confocal microscopy, Digital microscopy, Parylene coating, Surface treatment, Semiconductor fabrication, Thin film deposition, Sample heating, PCB prototyping, Microfluidics patterning, Laser induced graphene, Microfabrication…
An expert from Centre for Advanced 2D Materials (CA2DM), Ang Han Siong is the person to approach for queries involving in the area of Nano device fabrication and characterisation based on 2D materials…
An expert from Institute for Functional Intelligent Materials (I-FIM), Sourav Mitra is the person to approach for queries involving in the area of Surface analysis, Elemental and concentration analysis, Particle and molecular characterization, Separation and identification, Spectroscopy, Electrochemical analysis, Mechanical and thermal analysis…
An expert from Institute for Health Innovation & Technology (iHealthtech), Cheuk-Yan Au is the person to approach for queries involving in the area of Humidity control, Environmental testing, Stability testing, Moisture testing, Temperature and humidity testing, Controlled environments, Product testing, Soft polymer mechanical testing, 3D printing, Prototyping…
An expert from Institute for Health Innovation & Technology (iHealthtech), Juliette Ngan is the person to approach for queries involving in the area of Acrylic, wood, textiles laser cutting…
An expert from Institute for Health Innovation & Technology (iHealthtech), Zhang Wei is the person to approach for queries involving in the area of Magnetisation treatment…
An expert from Institute for Functional Intelligent Materials (I-FIM), Tummala Pinaka Pani is the person to approach for queries involving in the area of Large-area growth of MoS2 nanosheets, Fabrication of two-dimensional transition metal dichalcogenides (TMDs), Chemical vapor deposition (CVD), Furnace management and operation…
An expert from Institute for Functional Intelligent Materials (I-FIM), Chen Musen is the person to approach for queries involving in the area of Surface analysis, Elemental and concentration analysis, Particle and molecular characterization, Separation and identification, Spectroscopy, Electrochemical analysis, Mechanical and thermal analysis…
An expert from College of Design and Engineering, Materials Science and Engineering, Electron Microscopy Facility, Yang Fengzhen is the person to approach for queries involving in the area of Transmission electron microscopy (TEM)…
An expert from College of Design and Engineering, Materials Science and Engineering, T11 Shared Facilities, Electron Microscopy Facility, Ashley Xu is the person to approach for queries involving in the area of Helium ion microscopy, Material science, Optical spectroscopy, Nanofabrication, Electron microscopy, 2D materials, 2D material characterization…
An expert from College of Design and Engineering, Materials Science and Engineering, T11 Shared Facilities, Chiam Taw Chun is the person to approach for queries involving in the area of Material science, Nanofabrication, Electrical characterisation, 2D materials…
An expert from College of Design and Engineering, Materials Science and Engineering, T11 Shared Facilities, Jian Linke is the person to approach for queries involving in the area of Microfabrication, Lithography, SEM imaging, ICP dry etching, Optical mask making, Thin film deposition(eBeam & Thermal)…
An expert from Mechanobiology Institute, Gianluca Grenci is the person to approach for queries involving in the area of Si micromachining, Photo-patterning…
An expert from Mechanobiology Institute, Mohammed Ashraf is the person to approach for queries involving in the area of Si micromachining, Photo-patterning…
An expert from College of Design and Engineering, E6 NanoFab, Patrick Tang is the person to approach for queries involving in the area of General tool management…
An expert from College of Design and Engineering, E6 NanoFab, Loh Fong Leong is the person to approach for queries involving in the area of General tool management…
An expert from College of Design and Engineering, E6 NanoFab, Thomas Ang is the person to approach for queries involving in the area of Microelectronic fabrication…
An expert from College of Design and Engineering, E6 NanoFab, Htike Aung is the person to approach for queries involving in the area of Microelectronic fabrication…
An expert from College of Design and Engineering, E6 NanoFab, David Xu Baochang is the person to approach for queries involving in the area of Microelectronic fabrication…
An expert from College of Design and Engineering, E6 NanoFab, Xiao Yun is the person to approach for queries involving in the area of Lithography…
An expert from College of Design and Engineering, E6 NanoFab, Lin Zhong Guan is the person to approach for queries involving in the area of Microelectronic fabrication…
An expert from College of Design and Engineering, E6 NanoFab, Chua Kut Tiong is the person to approach for queries involving in the area of Microelectronic fabrication…
An expert from College of Design and Engineering, E6 NanoFab, Manohar Lal is the person to approach for queries involving in the area of Sub-10nm nanofabrication and nanolithography…
An expert from Solar Energy Research Institute of Singapore, Selvaraj Venkataraj is the person to approach for queries involving in the area of Solar cell device fabrication and characterization, Optical coatings, Thin film deposition, Magnetron sputtering…
An expert from Solar Energy Research Institute of Singapore, PV Devices Characterisation Group, Choi Kwan Bum is the person to approach for queries involving in the area of Photovoltaic cell characterisation…
An expert from Solar Energy Research Institute of Singapore, Building Integrated Photovoltaics, Srinath Nalluri is the person to approach for queries involving in the area of PV module fabrication, PV module testing and simulation…
An expert from Solar Energy Research Institute of Singapore, Building Integrated Photovoltaics, Carlos Clement is the person to approach for queries involving in the area of PV module fabrication, PV module characterisation, simulation and testing…
An expert from Solar Energy Research Institute of Singapore, Ison Jeffrey Garcia is the person to approach for queries involving in the area of Laser processing – Photovoltaic solar cells…
An expert from Centre for Quantum Technologies, Tony Wong is the person to approach for queries involving in the area of Microstructure fabrication, Micro machining, Precision manufacturing…
An expert from Life Science Institute, SynCTI, Teo Wei Zhe is the person to approach for queries involving in the area of Mass spectrometry and Liquid Handling…
An expert from College of Design and Engineering, Electron Microscopy Facility, Yao Bingqing is the person to approach for queries involving in the area of SEM, TEM, STEM, FIB, EDS, EELS…
An expert from College of Design and Engineering, Electron Microscopy Facility, Zhou Xin is the person to approach for queries involving in the area of SEM, TEM, STEM, FIB, EDS, EELS…
An expert from College of Design and Engineering, Materials Science and Engineering, T11 Shared Facilities, Electron Microscopy Facility, Chung Jing Yang is the person to approach for queries involving in the area of SEM, TEM, STEM, FIB, EDS, EELS…