The APT device enables near-atomic level resolution (~0.2 nm depth & ~0.4 nm lateral) and 3D compositional mapping with high chemical sensitivity (<5 appm) by field evaporation and time-of-flight mass spectrometry. ...
CDE
Ga+ Large Chamber FIB
The Versa 3D DualBeam FEG FIB-SEM combines a focused Ga ion beam with a high-resolution field-emission electron gun. Owing to a large chamber allowing up to 6″ industry wafers with full rotation, the Versa 3D provides enhanced 2D and 3D materials characterization and analysis for a wide range of material science and industry-related samples….
VSM (Vibrating Sample Magnetometer)
The VSM is used for measuring magnetic properties such as DC characterisation….
Bruker Icon Atomic Force Microscope
AFM utilises imaging techniques for surface analysis. It allows accurate and non-destructive measurements of the topography, electrical, and magnetic properties of a sample surface with high resolution….
SQUID (Superconducting QUantum Interference Device) Magnetometer
This equipment uses SQUID-based magnetometry / susceptibility to provide a stable magnetic field for material characterisation….
Scanning MOKE (Magneto-Optical Kerr Microscope & Magnetometer)
This equipment is used for visualisation of magnetic domains and magnetization processes as well as for optically recording magnetization curves qualitatively on all kinds of magnetic materials, including bulk specimens like sheets or ribbons, magnetic films and multilayers, patterned films or micro- and nanowires….
Molecular Beam Epitaxy (MBE) System
The fully integrated MBE system allows deposition of hetero-structures and semiconductors. IV and II-VI group deposition chambers are integrated with transfer chamber and load lock. The system has 5 ports for each chamber….
E-beam Lithography (Raith)
This is a fast, high-resolution, automated wafer and multi-sample exposures electron beam lithography tool….
SEM Sigma 300
The scanning electron microscope utilizes a focused beam of electrons to scan the surface of a sample. As the electron beam interacts with the specimen, it generates signals such as secondary electrons, backscattered electrons, and characteristic X-rays. These signals are detected and processed to create an image, revealing the topography, composition, and other features of the sample at high magnifications….
TEM 2800
The JEM-2800 is an advanced workhorse 200 kV transmission electron microscope with a Schottky-type field emission electron source. This multi-purpose S/TEM employs an user-friendly, high-stability operating system for high-resolution imaging in TEM (including diffraction modes) and STEM (imaging and EDS). Equipped with a TMP vacuum system, the JEM-2800 is particularly suited for fast screening of multiple samples….
TEM 2010F
The transmission electron microscope is a microscope whereby a beam of electrons is transmitted through an ultra-thin specimen, interacting with the specimen as it passes through. An image is formed from the interaction of the electrons transmitted through the specimen. The image is magnified and focused onto an imaging device, such as a fluorescent screen, on a layer of photographic film, or to be detected by a sensor such as a CCD camera….
Park Systems AFM (Atomic Force Microscope)
AFM utilises imaging techniques for surface analysis. It allows accurate and non-destructive measurements of the topography, electrical, and magnetic properties of a sample surface with high resolution….
Furnace (Horizontal)
Furnace system for wet and dry oxidation in the temperature range of 200 to 1000 degree Celsius…
Raman (Micro PL and Raman)
The Raman microscope acquires detailed chemical images and highly specific Raman data from discrete points. It analyses both large volumes and traces of material….
Hitachi Regulus FESEM w EDX
The FESEM system is used to capture the microstructure image of materials….
Tescan FIBSEM System
The FIBSEM system is used to capture the microstructure image of materials….
Hitachi Regulus FESEM
The FESEM system is used to capture the microstructure image of materials….
Chemo-Mechanical Polishing (CMP)
The CMP system is used for metal and dielectric planarization such as Cu Al, SiO2, SiN. It is able to accommodate polishing for coupon size up to 2 cm as well as wafer size up to 8 inches, with a finishing surface roughness of 1 nm….
Aberration-corrected Analytical S/TEM
The JEM-ARM200F is a 200 kV cold field-emission, probe-corrected transmission electron microscope with a STEM resolution of 0.078 nm and TEM resolution of 0.1 nm. It also has an energy-dispersive X-ray detector and dual energy loss spectrometers that can form elemental maps at atomic resolution, and a fast CMOS camera. With its probe aberration corrector and ultra-high-resolution pole piece it is particularly suited to STEM imaging and analysis….
Ar+ Ion Miller (TEM)
The Fischione 1051 TEM Mill allows for the preparation of TEM lamella samples through dual argon ion beams. Equipped with a touchscreen interface and camera, it can be operated through digital inputs as well as remotely….
Ar+ Ion Miller (TEM/SEM)
The Leica EM RES102 has two saddlefield ion sources with variable ion energies, with the capability of mounting a variety of samples for argon ion milling, including SEM and TEM samples….
Ar+ Ion Slicer
The Ion Slicer can prepare thin-film specimens without solvents or chemicals and requires no prior treatment of the specimen other than rectangular slicing (no disc grinding or dimple grinding)…
Ga+ Sample Preparation Focused Ion Beam
The FEI Helios 450S FIB is a dual beam Ga+ ion & electron microscope with high-resolution topographical imaging and patterning capabilities. The electron beam is primarily used for surface characterization, while the ion beam is used for top-down fabrication tasks such as TEM lamella preparation, cross-section failure analysis, and nanoscale surface modification. The stability of the low voltage ion beam and chamber cleaning attachments reduces contamination and amorphization vital for S/TEM analysis….
ICP Etch Cluster with 3 Modules / Plasma
The 3-chamber-modules advanced dry etching cluster system is used for micro- and nanomachining of various materials, with 8” wafer size, 300 mm diameter alumina discharge chamber, up to 8 mass flow controlled gas lines for each module and a minimum base pressure of 1×10-6 torr….
He+/Ne+ High-resolution FIB
The Orion NanoFab Helium Ion Microscope (HIM) operates using ionized Helium or Neon gases rather than electrons for imaging and milling of materials. With the significantly smaller interaction volume, alongside the smaller de Broglie wavelength, the HIM can achieve finer spatial resolution and larger depth-of-field compared to a FE-SEM. Nanomachining fabrication with sub-10 nm feature sizes is achievable through lighter He ions, while faster milling is operated through heavier Ne ions….
E-beam/Thermal Evaporator
This UHV deposition system is capable of producing good quality thin films of metals, alloys and their multilayers Able to handle 8” wafers size. Targets E-beam: Ti, Cr, Al Thermal: Au, Cu…
Raman Spectrometer
The Raman microscope offers advanced confocal imaging capabilities in 2D and 3D. The true confocal Raman microscope enables the most detailed images and analyses to be obtained with speed and confidence. With guaranteed high performance and intuitive simplicity, the LabRAM HR Evolution is the ultimate instrument for Raman spectroscopy. They are widely used for standard Raman analysis, PhotoLuminescence (PL), Tip Enhanced Raman Spectroscopy (TERS) and other hybrid methods….
AJA Metal & Dielectric Sputtering System
This system uses close proximity physical vapour deposition with magnetron technology. The target-to-substrate distance is adjustable between 50-100 mm. The system accepts 3” diameter target size, various sample sizes and a maximum of 8” wafer….
Etcher for Magnetic Materials – SCIA
The SCIA Coat 200 is designed for homogeneous coating of high precision optics such as X-ray mirrors and optical filters with the technology of Dual Ion Beam Deposition (DIBD). The system is also equipped with a RF350-e ion beam source for etching process….
Laser Writer System – TLG (Heidelberg)
Heidelberg DWL 66+ laserwriter is a high resolution pattern generator for direct writing and mask making….
Magnetic Annealing System
This system applies an external magnetic field during the annealing process, which serves as an effective process to enhance the performance of magnetic devices and materials….
Mask Aligner MA8
The Mask Aligner 8 system is a precision photolithography tool used in the fabrication of microelectronic devices. It aligns a photomask with a substrate, typically a silicon wafer, and then exposes the substrate to ultraviolet (UV) light. This process transfers the mask’s pattern onto a light-sensitive photoresist layer on the substrate….
Atomic Layer Deposition System (ALD)
This system is used for the atomic layer deposition (ALD) of metal nitrides, oxides and sulphides with thermal and plasma processes….
XRD (Thin Film)
D8 ADVANCE provides a range of hardware and software solutions for X-ray diffraction and scattering applications, including phase identification, quantitative phase analysis, micro-structure and crystal structure analysis….
Fluorescence Spectrometer
The fluorescence spectrometer allows user to shine light from UV-Vis range at a sample and collect its fluorescence spectrum….
PerkinElmer FTIR Spectrometer, with ATR Accessory
The FTIR spectrometer allows the user to shine infrared light at a sample and measure its absorbance or transmittance spectrum. The ATR accessory enables simpler and quicker measurement compared with the traditional methods (with some trade-off)….
Agilent FTIR Spectrometer, with ATR Accessory
The FTIR spectrometer allows the user to shine infrared light at a sample and measure its absorbance or transmittance spectrum. The ATR accessory enables simpler and quicker measurement compared with the traditional methods (with some trade-off)….
UV-Vis Spectrometer with an Integrating Sphere
The UV-Vis spectrometer allows user to shine light in the UV-visible range through a sample and measure its absorbance or transmittance spectrum. The integrating sphere expands its capability allowing measurement of reflectance spectrum (diffuse or specular)….
UV-Vis Spectrometer
The UV-Vis spectrometer allows user to shine light in the UV-visible range through a sample and measure its absorbance or transmittance spectrum….
KLA Tencor Stylus Profilometer
The stylus profilometer allows user to scan the surface of a sample with a stylus (i.e. contact method) and then characterize its surface roughness, or determine the depth of a groove, etc….
Bruker Stylus Profilometer
The stylus profilometer allows user to scan the surface of a sample with a stylus (i.e. contact method) and then characterize its surface roughness, or determine the depth of a groove, etc….
STA (Simultaneous Thermal Analysis) Instrument
The STA instrument combines function of the TGA and the DSC. It allows user to measure at the same time both the heat flow and the mass change of a sample when it is heated….
TGA (ThermoGravimetric Analysis) Instrument
The TGA instrument allows the user to measure the mass change in a sample when it is heated at a constant rate, at a constant temperature, or both….
DSC (Differential Scanning Calorimetry) Instrument
The DSC instrument allows user to measure the heat flow into (or out of) a sample when it is heated or cooled, and use the data to determine its melting point, Tg, etc….
Plasma Etch System
This system enables the cleaning of surfaces, such as before bonding, soldering or gluing, as well as the activation of surfaces before printing, varnishing or gluing. Gases available are Ar, O2 and N2….
ICP Etch System SI 500
An ICP etch system that utilizes plasma generated by inductively coupled sources to precisely etch materials on substrates through ion bombardment, ensuring high precision and control….
2″ Chemical Vapour Deposition
Split tube furnaces can be used for a wide range of applications where precise temperature control and the ability to easily insert and remove samples are important. Compact design for minimum space requirement….
Spin Coater
Fully programmable and user-friendly, the Cee® 200X features the accuracy and repeatability needed to eliminate processing variability from photoresist and thin film deposition processes….
Surface Stylus Profiler
Stylus profilometer allows user to scan the surface of a sample with a stylus (i.e. contact method) and then characterize its surface roughness, or determine the depth of a groove, etc….
Heidelberg Laser Writer
Heidelberg laser writer is a high resolution pattern generator for direct writing and mask making….
Graphene CVD
Graphene CVD is a process used to produce high-quality graphene sheets. This technique involves depositing carbon atoms onto a substrate, typically copper, at high temperatures. A carbon-containing gas, such as methane, is introduced into a reaction chamber where it decomposes on the hot substrate, allowing the carbon atoms to arrange themselves into a single layer of graphene. This method is preferred for its ability to produce large-area graphene with excellent electronic properties, making it suitable for applications in electronics, sensors, and other advanced technologies….
4″ Chemical Vapour Deposition
Split tube furnaces can be used for a wide range of applications where precise temperature control and the ability to easily insert and remove samples are important. Compact design for minimum space requirement….
Multipurpose Atomic Force Microscope
The Park NX10 AFM features a True Non-Contact™ scan Mode that produces high resolution and accurate data by preventing destructive tip-sample interaction during a scan. Its compact and rigid ‘Step-and-Scan’ enables programmable multiple region imaging….
Mask Aligner – T Lab
The Mask Aligner MJB4 system is a precision photolithography tool used in the fabrication of microelectronic devices. It aligns a photomask with a substrate, typically a silicon wafer, and then exposes the substrate to ultraviolet (UV) light. This process transfers the mask’s pattern onto a light-sensitive photoresist layer on the substrate….
Digital Automated
The Olympus DSX1000 is an upright fully digital microscope with automated xyz and focusing functions. The tilting head allows sample imaging from multiple angles and lens can be selected for a variety of field-of-views….
Inverted Motorized
The ECLIPSE Ti2 is an inverted microscope delivering 25 mm field of view with stable, drift-free platform for high-speed imaging applications….
Dry Pumping Station
This station is used to store TEM holders….
Plasma Cleaner
The Gatan Solarus II is a plasma cleaning system for removing organic surface contaminants through user-defined gas-flow plasma….
UV Ozone Cleaner
The ZONETEM II utilizes vacuum-controlled UV irradiation to gently eliminate hydrocarbon contamination for electron microscopy imaging….
Ultramicrotome
The Leica Ultracut UCT ultramicrotome is an instrument commonly used to prepare TEM samples. It uses either a glass or diamond knife to cut ultra thin sections of specimens embedded in epoxy. The sections are approximately 60 to 100 nanometers in thickness and 0.5 to 3 mm in width and can be stained and mounted onto TEM grids for viewing….
Target Surfacing System
The Leica EM TXP is a target preparation device for milling, sawing, grinding, and polishing samples prior to examination by SEM, TEM, and LM techniques….
Gas Cell Protochips
The Protochips Atmosphere allows the in-Operando study of materials under realistic environmental conditions. Based on a TEM holder closed-cell design, Atmosphere is a fully automated system that includes a computer controlled gas manifold and a feature-rich software interface….
Measuring Microscope
The device has excellent versatility and high performance for measurements of parts and electrical components, with sub-micron precision….
TEM Heating and Biasing Holder
The Lightning in-situ TEM biasing & heating holder provides real-time information under a controllable electrical and thermal environment in the microscope….
Cryo-transfer
The Elsa cryo-transfer holder is a single-tilt liquid nitrogen holder designed for the frost-free transfer of a sample at liquid nitrogen temperature….
Vac-transfer/Cryo
The Mel Build Defend Atmos Defend holder incorporates a specially designed vacuum transfer system and a mechanical drift cancellation controller. The holder can be tilted along two axes and cooled down to -160°C….
TEM 3010
The transmission electron microscope is a microscope whereby a beam of electrons is transmitted through an ultra-thin specimen, interacting with the specimen as it passes through. An image is formed from the interaction of the electrons transmitted through the specimen. The image is magnified and focused onto an imaging device, such as a fluorescent screen, on a layer of photographic film, or to be detected by a sensor such as a CCD camera….
Tan Xipeng
An expert from College of Design and Engineering, University Electron Microscopy Centre, APT Facility, Tan Xipeng is the person to approach for queries involving in the area of Brightfield, Widefield, Fluorescence, 3D imaging, Scanning Confocal, Spinning Disk confocal, Multiphoton, Live cell imaging, Calcium imaging, F-techniques, FRAP, FCS, FCCS, Image analysis, 3D visualisation, Experimental planning…
Jonathan Aristya Setyadji
An expert from College of Design and Engineering, University Electron Microscopy Centre, APT Facility, Jonathan Aristya Setyadji is the person to approach for queries involving in the area of Brightfield, Widefield, Fluorescence, 3D imaging, Scanning Confocal, Spinning Disk confocal, Multiphoton, Live cell imaging, Calcium imaging, F-techniques, FRAP, FCS, FCCS, Image analysis, 3D visualisation, Experimental planning…
Jian Linke
An expert from College of Design and Engineering, Materials Science and Engineering, T11 Shared Facilities, Jian Linke is the person to approach for queries involving in the area of Microfabrication, Lithography, SEM imaging, ICP dry etching, Optical mask making, Thin film deposition(eBeam & Thermal)…
Tihomir Marjanovic
An expert from College of Design and Engineering, Materials Science and Engineering, T11 Shared Facilities, Tihomir Marjanovic is the person to approach for queries involving in the area of Material Science, Precise instrumentation, System optimization in nanotechnology and electrical control system…
Li Haobo
An expert from College of Design and Engineering, Materials Science and Engineering, T11 Shared Facilities, Li Haobo is the person to approach for queries involving in the area of Materials Science, Thin film and 2D materials deposition and characterization, Photolithography…
Chiam Taw Chun
An expert from College of Design and Engineering, Materials Science and Engineering, T11 Shared Facilities, Chiam Taw Chun is the person to approach for queries involving in the area of Material science, Nanofabrication, Electrical characterisation, 2D materials…
Yang Fengzhen
An expert from College of Design and Engineering, Materials Science and Engineering, Electron Microscopy Facility, Yang Fengzhen is the person to approach for queries involving in the area of Transmission electron microscopy (TEM)…
Shen Jingjing
An expert from College of Design and Engineering, Materials Science and Engineering, Shen Jingjing is the person to approach for queries involving in the area of Scanning Electron Microscopy (SEM)…
Chen Qun
An expert from College of Design and Engineering, Materials Science and Engineering, Chen Qun is the person to approach for queries involving in the area of X-Ray Diffraction (XRD)…
Henche Kuan
An expert from College of Design and Engineering, Materials Science and Engineering, Henche Kuan is the person to approach for queries involving in the area of Thermal analysis, Stylus profilometry, Spectrometry (UV-Vis), Spectrometry (FTIR), Spectrometry (Fluorescence)…
Ashley Xu
An expert from College of Design and Engineering, Materials Science and Engineering, T11 Shared Facilities, Electron Microscopy Facility, Ashley Xu is the person to approach for queries involving in the area of Helium ion microscopy, Material science, Optical spectroscopy, Nanofabrication, Electron microscopy, 2D materials, 2D material characterization…
Patrick Tang
An expert from College of Design and Engineering, E6 NanoFab, Patrick Tang is the person to approach for queries involving in the area of General tool management…
Htike Aung
An expert from College of Design and Engineering, E6 NanoFab, Htike Aung is the person to approach for queries involving in the area of Microelectronic fabrication…
Loh Fong Leong
An expert from College of Design and Engineering, E6 NanoFab, Loh Fong Leong is the person to approach for queries involving in the area of General tool management…
Thomas Ang
An expert from College of Design and Engineering, E6 NanoFab, Thomas Ang is the person to approach for queries involving in the area of Microelectronic fabrication…
Manohar Lal
An expert from College of Design and Engineering, E6 NanoFab, Manohar Lal is the person to approach for queries involving in the area of Sub-10nm nanofabrication and nanolithography…
Musni
An expert from College of Design and Engineering, E6 NanoFab, Musni is the person to approach for queries involving in the area of Raman microscopy…
Linn Linn
An expert from College of Design and Engineering, E6 NanoFab, Linn Linn is the person to approach for queries involving in the area of Semiconductor device cross section analyses, Advanced coating thickness and structure uniformity determination, Small contamination feature geometry and elemental composition measurement…
Chua Kut Tiong
An expert from College of Design and Engineering, E6 NanoFab, Chua Kut Tiong is the person to approach for queries involving in the area of Microelectronic fabrication…
Lin Zhong Guan
An expert from College of Design and Engineering, E6 NanoFab, Lin Zhong Guan is the person to approach for queries involving in the area of Microelectronic fabrication…
Xiao Yun
An expert from College of Design and Engineering, E6 NanoFab, Xiao Yun is the person to approach for queries involving in the area of Lithography…
David Xu Baochang
An expert from College of Design and Engineering, E6 NanoFab, David Xu Baochang is the person to approach for queries involving in the area of Microelectronic fabrication…
Tan Shengdong
An expert from College of Design and Engineering, Electron Microscopy Facility, Tan Shengdong is the person to approach for queries involving in the area of SEM, TEM, STEM, FIB, EDS, EELS…
Yao Bingqing
An expert from College of Design and Engineering, Electron Microscopy Facility, Yao Bingqing is the person to approach for queries involving in the area of SEM, TEM, STEM, FIB, EDS, EELS…
Zhou Xin
An expert from College of Design and Engineering, Electron Microscopy Facility, Zhou Xin is the person to approach for queries involving in the area of SEM, TEM, STEM, FIB, EDS, EELS…
Chung Jing Yang
An expert from College of Design and Engineering, Materials Science and Engineering, T11 Shared Facilities, Electron Microscopy Facility, Chung Jing Yang is the person to approach for queries involving in the area of SEM, TEM, STEM, FIB, EDS, EELS…