Wire Bonder

Description
Benchtop semi-auto wire bonder

Technical Specifications
Ball-Wedge bonding
Wedge-Wedge bonding
Ball stud bumping
Ribbon bonding
Stitch bonding
Ball bump on stitch
Bond-stitch-on-ball
90° vertical wire feed with motorised wire clamp and automatic wire spool
Motorised Y- and Z-axes stage control:
• Z-axis Travel minimum 17mm with ≤1µm steps
• Y-axis Travel minimum 10mm with ≤1µm steps

Able to work with gold and aluminum
• Wire diameter: from <20 µm to >70 µm
• Ribbon dimension: minimum <30x< 275 µm

Stereo Microscope
• Minimum 110x optical zoom with HD camera

Heated workholder minimum 90 mm diameter with temperature setting maximum 250°C

Model
Wire Bonder HB10 / HB16

Manufacturer
TPT

Application
Microscopically bond wires between device contacts and chip carriers

Special Remarks
N/A

Location
Institute for Functional Intelligent Materials (I-FIM)
NUS Science S9-08-08D
Precision Fabrication Lab
4 Science Drive 2, Singapore 117544

Booking Information
Charges: Contact Dr. Sourav Mitra (sourav_m@nus.edu.sg) and Dr. Kristina Vaklinova (kristina@nus.edu.sg)
Service or Self-operated: Self-operated after training
Website for booking: https://ifim.nus.edu.sg/services/

Key Contact(s)
Kristina Vaklinova
kristina@nus.edu.sg