Description
This advanced tool uses thermally induced mechanical stress to separate brittle semiconductor materials like silicon wafers. As opposed to conventional laser cutting, no bulging and no formation of particles occur, because the substrate is merely heated and not vaporised. The mechanical stability of TLS-processed solar cells is significantly greater than conventionally processed solar cells.
Technical Specifications
Laser source 1: 20 W pulsed fiber laser, 30 to 60 kHz
Laser source 2: 250 W continuous laser
Maximum workpiece size: 188 mm
Model
microPRO TMS
Manufacturer
3D Micromac
Application
PV cell cutting
Special Remarks
N/A
Location
Solar Energy Research Institute of Singapore, Building Integrated Photovoltaics
College of Design and Engineering
E3A-CTO-06-01
7 Engineering Drive 1
Singapore 117574
Booking Information
Charges: N/A
Service or Self-operated: Service required
Website for booking: N/A
Key Contact(s)
Carlos Clement
carlos.clement@nus.edu.sg
Fabrication | Materials | SERIS | Equipment