Reactive Ion Etching

Description
A plasma reactor for the dry etching of silicon and silicon oxide using photoresist masks.

Technical Specifications
500W Rf power
4 gases: CF4, SF6, Ar and O2
Up to 8″ wafers

Model
10NR

Manufacturer
SAMCO

Application
Silicon and dielectric dry etching

Special Remarks
Equipped with CF4, O2, SF6 and Ar, RF power supply 500W. Standard recipes available, open for process development.
Services produced by the tool are available through our internal staff, not direct access.

Location
Mechanobiology Institute, micro-nano Fabrication Core
Temasek Laboratories @ NUS
Level 5 micro-nano Fabrication Core
5A Engineering Drive 1, Singapore 117411

Booking Information
Charges: N/A
Service or Self-operated: Service required
Website for booking: N/A

Key Contact(s)
Gianluca Grenci
mbigg@nus.edu.sg

Mohammed Ashraf
mbima@nus.edu.sg

Fabrication | Life Science | Materials | MBI | Equipment