Description
This device is used for laser UV lithography, direct writing for optical mask production and direct wafer patterning.
Technical Specifications
Mask writing
• Positive tone photoresist (e.g. AZ) up to 1.5 microns thick, resolution 1 micron for line features, about 2 microns for more complex geometries
• Negative tone photoresist (e.g. SU-8) up to 70 microns thick
Gray-scale lithography with up to 256 levels
Optical alignment for multi-layer patterning
Model
MLA150
Manufacturer
Heidelberg Instruments
Application
Direct patterning for optical mask and wafer lithography
Special Remarks
Services produced by the tool are available through our internal staff, not direct access.
Location
Mechanobiology Institute, micro-nano Fabrication Core
Temasek Laboratories @ NUS
Level 5 micro-nano Fabrication Core
5A Engineering Drive 1, Singapore 117411
Booking Information
Charges: N/A
Service or Self-operated: Service required
Website for booking: N/A
Key Contact(s)
Gianluca Grenci
mbigg@nus.edu.sg
Mohammed Ashraf
mbima@nus.edu.sg
Fabrication | Life Science | Materials | MBI | Equipment