Inline Multi-Chamber Magnetron Sputter Deposition

Description
This multichamber physical vapour deposition (PVD) sputtering platform is designed to handle silicon wafers and glass panes. The SV-540 is a state-of-the-art machine having dedicated chambers for the sputtering of metallic, dielectric and TCO/TMO layers. The processing chambers are equipped with planar magnetron sources for DC sputtering of metals, oxides and oxynitrides in the reactive mode, and with a cylindrical dual-magnetron source and planar sources for pulsed DC sputtering of dielectrics and TCOs/TMOs, with substrate heating up to 500 degree Celsius..

Technical Specifications
Available materials:
• Al:ZnO, ITO targets for TCO applications
• Al, In, Zn and Ag targets for metal or oxide deposition in reactive sputter mode

Max. substrate size: 30 cm x 40 cm
Substrate temperature: Up to 300°C

Model
FHR Line 540

Manufacturer
FHR Anlagen au GmbH, Germany

Application
Thin film deposition by magnetron sputtering

Special Remarks
Booking system available for SERIS internal staff only.

Location
Solar Energy Research Institute of Singapore
College of Design and Engineering
E3A-02B
7 Engineering Drive 1
Singapore 117574

Booking Information
Charges: N/A
Service or Self-operated: Service required
Website for booking: N/A

Key Contact(s)
Selvaraj Venkataraj
serselva@nus.edu.sg


Fabrication | Materials | SERIS | Equipment