Description
The high end plasma etching system SI 500 uses an inductively coupled plasma with low ion energy for low damage etching and nano structuring.
Technical Specifications
ICP plasma etching tool
With vacuum load lock
For up to 4″ wafers
Substrate temperature control
Model
SI 500
Manufacturer
SENTECH
Application
• Inductive coupled plasma (ICP) processing of Si
• Deep vertical etching
Special Remarks
Equipped with CF4, SF6, CHF3, C4F8, Ar and O2 capable of Bosch-type processes. Standard recipes available, open for process development.
Services produced by the tool are available through our internal staff, not direct access.
Location
Mechanobiology Institute, micro-nano Fabrication Core
Temasek Laboratories @ NUS
Level 5 micro-nano Fabrication Core
5A Engineering Drive 1, Singapore 117411
Booking Information
Charges: N/A
Service or Self-operated: Service required
Website for booking: N/A
Key Contact(s)
Gianluca Grenci
mbigg@nus.edu.sg
Mohammed Ashraf
mbima@nus.edu.sg
Fabrication | Life Science | Materials | MBI | Equipment