Description
This UHV deposition system is capable of producing good quality thin films of metals, alloys and their multilayers Able to handle 8” wafers size. Targets E-beam: Ti, Cr, Al Thermal: Au, Cu
Technical Specifications
Load lock best vacuum: 10-7 torr
Main chamber best vacuum: 10-9 torr
Cylindrical chamber size: 36″ high x 24″ diameter
Substrate rotation during deposition
Equipped with quartz thickness monitor
Four thermal evaporation sources (molybdenum boats) and 5 E-beam crucible sources (graphite)
Model
ATC-ORION-8E UHV
Manufacturer
AJA International, Inc
Application
Thin film deposition includes thermal evaporation (Cu, Au, etc.) and e-beam evaporation (Cr, Ti, Al, etc.)
Special Remarks
Open to both NUS and external users.
Contact Ngee Hong Teo (mtnh@nus.edu.sg) and Tiho (tiho@nus.edu.sg) to schedule a project meeting.
Location
Materials Science and Engineering, T11 Shared Facilities
Temasek Laboratories @ NUS
Level 11
5A Engineering Drive 1, Singapore 117411
Booking Information
Charges: This is not in public domain yet.
Service or Self-operated: Self-operated
Website for booking: N/A
Key Contact(s)
Chiam Taw Chun
tawcun@u.nus.edu
CDE | Fabrication | Material Synthesis and Deposition | Materials | Equipment