Description
The DRIE uses special gases for standard industry semiconductor etching purpose. It is able to etch the samples in 2 modes, Bosch (chiller mode) and the Cryo (liquid nitrogen mode which could go to sub 20°C). Apart from being able to etch silicon substrates, it could be used to etch oxides and nitrides and provide good selectivity. It is also equipped with a load-lock and the processes are automated and user-friendly.
Technical Specifications
N/A
Model
Plasma100
Manufacturer
Oxford Instruments
Application
Deep reactive Ion etching for 2D materials (non-metallic)
Special Remarks
Cleanroom class 100 and class 1000
Location
Centre for Advanced 2D Materials (CA2DM)
NUS Science S14-01-02
6 Science Drive 2, Singapore 117546
Booking Information
Charges: N/A
Service or Self-operated: Self-operated
Website for booking: https://graphene.nus.edu.sg/our-solutions/tools-usage/
Key Contact(s)
Ang Han Siong
c2dahs@nus.edu.sg
CA2DM | Fabrication | Materials | Equipment