Description
For department/faculty use only.
The hybrid scribing system from MDI, Japan is used for P1, P2 and P3 pattering and preparing of thin-film and tandem mini-modules of sizes up to 30 cm × 30 cm. The machine features both laser and mechanical scribing methods to prepare thin-film mini-modules and mimics the scribing processes commonly used in CIGS PV module production. The system is equipped with a laser source for metal scribing (P1 step) and two dedicated mechanical heads for thin-film diode scribing (P2 step) and front TCO scribing (P3 step). Both laser and mechanical scribe line widths can be varied from 30 to 60 μm.
Technical Specifications
Laser head (532 nm) for P1 scribing
Mechanical head for P2 and P3 scribing
Scribing width: 30 to 60 μm
Model
MPV300-LMM
Manufacturer
Mitsuboshi Diamond Industrial (MDI) Co., Ltd., Japan
Application
CIGS PV mini module scribing
Special Remarks
Tool is exclusively designed to handle CIGS/CdS solar cells on 30×30 cm glass substrates. Due to Cd heavy metal contamination, the tool is not available for external users.
Location
Solar Energy Research Institute of Singapore
College of Design and Engineering
E3A-02A
7 Engineering Drive 1
Singapore 117574
Booking Information
Charges: N/A
Service or Self-operated: SERIS internal use only
Website for booking: N/A
Key Contact(s)
Selvaraj Venkataraj
serselva@nus.edu.sg
Fabrication | Materials | SERIS | Equipment